Vacuum film formation device (sputtering device, deposition device)
Large area sputtering is possible! Film deposition can be achieved even without cooling.
We would like to introduce our "Vacuum Deposition Equipment." Argon plasma is confined between two opposing targets, and the confined argon plasma ejects target material, which is deposited onto a substrate positioned at a 90-degree angle to the target. Additionally, by preserving the magnetic moment in a gradually changing magnetic field, the kinetic energy of the component parallel to the magnetic field plus the kinetic energy of the component perpendicular to the magnetic field remains constant, causing charged particles to be reflected at both ends of the magnetic poles. 【Features】 ■ Low-temperature deposition ■ High vacuum sputtering ■ Unique sputtering technology (composition control of the film, uniform plasma) ■ Proprietary magnetron cathode *For more details, please download the PDF or feel free to contact us.
- Company：ヤシマ
- Price：Other
